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IEC 60749-3:2017

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Standard Details

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-3:2017
Document Year: 2017
Pages: 11
Edition: 2.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-3:2017
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