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IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Standard Details

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61191-3:2017
Document Year: 2017
Pages: 20
Edition: 2.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.240 Mechanical structures for electronic equipment

Life Cycle

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IEC 61191-3:2017
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