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IEC 61191-3:1998

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Standard Details

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC 61191-3:1998
Document Year: 1998
Pages: 31
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.240 Mechanical structures for electronic equipment

Life Cycle

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WITHDRAWN
IEC 61191-3:1998
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