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    IEEE/IEC 63055 : 2023

    IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design

    Standard Details

    A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.

    General Information

    Status : ACTIVE
    Standard Type: Main
    Document No: IEEE/IEC 63055 : 2023
    Document Year: 2023
    Pages: 298

    Life Cycle

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    ACTIVE
    IEEE/IEC 63055 : 2023

    ACTIVE
    IEEE/IEC 63055:2023

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