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IEC 63378-6:2026

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Standard Details

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63378-6:2026
Document Year: 2026
Pages: 28
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 63378-6:2026
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