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IEC 61189-3-719:2016 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Standard Details

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-3-719:2016 (EN-FR)
Document Year: 2016
Pages: 22
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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IEC 61189-3-719:2016 (EN-FR)
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