logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Standard Details

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-3-302:2025
Document Year: 2025
Pages: 17
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

Currently Viewing

ACTIVE
IEC 61189-3-302:2025
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2025 BSB Edge Private Limited.

Enquire now +