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IEC

IEC 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Standard Details

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2:2006
Document Year: 2006
Pages: 122
Edition: 2.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-2:2006
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