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IEC 61189-2-807:2021 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Standard Details

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2-807:2021 (EN-FR)
Document Year: 2021
Pages: 17
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-2-807:2021 (EN-FR)
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