logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 61189-2-803:2023 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Standard Details

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2-803:2023 (EN-FR)
Document Year: 2023
Pages: 16
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

Currently Viewing

ACTIVE
IEC 61189-2-803:2023 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +