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IEC 61189-2-801:2023 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Standard Details

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2-801:2023 (EN-FR)
Document Year: 2023
Pages: 21
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-2-801:2023 (EN-FR)
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