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IEC 61189-2-501:2022 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Standard Details

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2-501:2022 (EN-FR)
Document Year: 2022
Pages: 32
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-2-501:2022 (EN-FR)
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