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IEC 61189-11:2013 (EN-FR)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Standard Details

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-11:2013 (EN-FR)
Document Year: 2013
Pages: 30
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-11:2013 (EN-FR)
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