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DIN EN IEC 61189-3-302 (DRAFT) : 2025

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (IEC 91/1973/CDV:2024); German and English version prEN IEC 61189-3-302:2024

General Information

Status : ACTIVE
Standard Type: Main
Document No: DIN EN IEC 61189-3-302 (DRAFT) : 2025
Document Year: 2025

Life Cycle

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ACTIVE
DIN EN IEC 61189-3-302 (DRAFT) : 2025
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