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IEC 61189-2-804:2023 (EN-FR)

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Standard Details

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61189-2-804:2023 (EN-FR)
Document Year: 2023
Pages: 16
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61189-2-804:2023 (EN-FR)
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