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IEC

IEC 61189-3:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Standard Details

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC 61189-3:1997
Document Year: 1997
Pages: 105
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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WITHDRAWN
IEC 61189-3:1997
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