logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Standard Details

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63251:2023
Document Year: 2023
Pages: 42
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

Currently Viewing

ACTIVE
IEC 63251:2023
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +