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IEC 61760-4:2015 (EN-FR)

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Standard Details

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61760-4:2015 (EN-FR)
Document Year: 2015
Pages: 66
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 61760-4:2015 (EN-FR)
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