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Standard Test Methods for Pasted Mica Used in Electrical Insulation
1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.
1.2 These test methods appear in the following sections:
Test | Sections |
Compressive Creep | 4 – 10 |
Dielectric Strength | 38 – 41 |
Mica or Binder Content | 19 |
Molding Test | 31 – 36 |
Organic Binder | 20 – 24 |
Resistivity | 42 – 46 |
Silicone Binder | 25 – 30 |
Stability Under Heat and Pressure | 11 – 18 |
1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.
1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.
1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
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