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IEC 62418:2010 (EN-FR)

Semiconductor devices - Metallization stress void test

Standard Details

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62418:2010 (EN-FR)
Document Year: 2010
Pages: 34
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 62418:2010 (EN-FR)
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