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IEC 60749-40:2011 (EN-FR)

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Standard Details

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-40:2011 (EN-FR)
Document Year: 2011
Pages: 44
Edition: 1.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60749-40:2011 (EN-FR)
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