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IEC 60749-23:2025

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Standard Details

IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document.
This edition includes the following significant technical changes with respect to the previous edition:
a) absolute stress test definitions and resultant test durations have been updated.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60749-23:2025
Document Year: 2025
Pages: 9
Edition: 2.0
  • Section Volume:
  • TC 47 Semiconductor devices
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60749-23:2025
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