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BS EN IEC 60749-22-1:2026

Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 60749-22-1:2026
Document Year: 2026
Pages: 68
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • GBM18 Electrical Components (GMB18)

Life Cycle

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Definitive
BS EN IEC 60749-22-1:2026
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