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IEC TS 62647-3:2014

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes

Standard Details

IEC TS 62647-3:2014(E) defines for circuit card assemblies a default method for those companies that require a pre-defined approach, and a protocol for those companies that wish to develop their own test methods. The intent of this document is to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that may be unable to develop methods specific to their own products and applications. It should be used when little or no other information is available to define, conduct, and interpret results from reliability, qualification, or other tests for electronic equipment containing lead-free (Pb-free) solder. The default method is intended to be conservative, i.e., it is biased toward minimizing the risk to users of avionics electronic equipment.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TS 62647-3:2014
Document Year: 2014
Pages: 42
Edition: 1.0
  • Section Volume:
  • TC 107 Process management for avionics
  • ICS:
  • 03.100.50 Production. Production management
  • 31.020 Electronic components in general
  • 49.060 Aerospace electric equipment and systems

Life Cycle

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ACTIVE
IEC TS 62647-3:2014
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