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IEC 61188-5-4:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Standard Details

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61188-5-4:2007
Document Year: 2007
Pages: 15
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
IEC 61188-5-4:2007
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