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IEC 60191-6-6:2001 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Standard Details

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-6:2001 (EN-FR)
Document Year: 2001
Pages: 25
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60191-6-6:2001 (EN-FR)
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