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IEC 60191-6-4:2003 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Standard Details

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-4:2003 (EN-FR)
Document Year: 2003
Pages: 32
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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ACTIVE
IEC 60191-6-4:2003 (EN-FR)
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