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IEC 60191-6-22:2012 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Standard Details

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-22:2012 (EN-FR)
Document Year: 2012
Pages: 34
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 60191-6-22:2012 (EN-FR)
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