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IEC 60191-6-20:2010 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Standard Details

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-20:2010 (EN-FR)
Document Year: 2010
Pages: 21
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 60191-6-20:2010 (EN-FR)
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