Standards Manage Your Business

We Manage Your Standards


IEC 60191-6-2:2001 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Standard Details

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-2:2001 (EN-FR)
Document Year: 2001
Pages: 21
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

Currently Viewing

IEC 60191-6-2:2001 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +