IEC 60191-6-2:2001 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Standard Details

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

General Information

Status : ACTIVE

Standard Type: Main

Document No: IEC 60191-6-2:2001 (EN-FR)

Document Year: 2001

Pages: 21

Edition: 1.0

Section Volume:
TC 47.SC 47D Semiconductor devices packaging

ICS:
31.080.01 Semiconductor devices in general

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IEC 60191-6-2:2001 (EN-FR)

IEC 60191-6-2:2001 (EN-FR)

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