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IEC 60191-6-17:2011 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Standard Details

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-17:2011 (EN-FR)
Document Year: 2011
Pages: 53
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60191-6-17:2011 (EN-FR)
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