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IEC 60191-6-13:2016 (EN-FR)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Standard Details

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:
a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-13:2016 (EN-FR)
Document Year: 2016
Pages: 36
Edition: 2.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 60191-6-13:2016 (EN-FR)
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