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IEC 60191-6-1:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Standard Details

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-6-1:2001
Document Year: 2001
Pages: 7
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

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IEC 60191-6-1:2001
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