Standards Manage Your Business

We Manage Your Standards


IEC 60191-5:1997 (EN-FR)

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Standard Details

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 60191-5:1997 (EN-FR)
Document Year: 1997
Pages: 71
Edition: 2.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

Life Cycle

Currently Viewing

IEC 60191-5:1997 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +