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IEC 63011-2:2018 (EN-FR)

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Standard Details

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63011-2:2018 (EN-FR)
Document Year: 2018
Pages: 28
Edition: 1.0
  • ICS:
  • 31.200 Integrated circuits. Microelectronics

Life Cycle

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IEC 63011-2:2018 (EN-FR)
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