Standards Manage Your Business

We Manage Your Standards


IEC 63011-1:2018 (EN-FR)

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

Standard Details

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 63011-1:2018 (EN-FR)
Document Year: 2018
Pages: 24
Edition: 1.0
  • ICS:
  • 31.200 Integrated circuits. Microelectronics

Life Cycle

Currently Viewing

IEC 63011-1:2018 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +