ISO/TS 10303-1622:2006

Industrial automation systems and integration — Product data representation and exchange — Part 1622: Application module: AP210 interconnect technology constraints

Standard Details

ISO/TS 10303-1622:2006 specifies the application module for AP210 interconnect technology constraints.

ISO/TS 10303-1622:2006 deals with the representation of interconnect technology constraints. This data includes all information provided to the design team by fabrication suppliers from which may be derived default land and passage definitions, based on the desired yield for fabrication and assembly processes. Typical data includes

minimum annular ring,
maximum passage aspect ratio,
minimum deposition thickness,
maximum terminal size supported for through hole technology class, and
other critical material processing properties.

Configuration management information and design change management information is provided. This data includes at least one geometric representation. ISO/TS 10303-1622:2006 also supports description of simple and complex templates for layout design, and definition of technology specific layer stackup models able to support multiple material combinations.

The following are within the scope of ISO/TS 10303-1622:2006:

fabrication technology properties;
layout pattern templates;
layout pattern template properties;
definition of stratum stack model;
manufacturing technology specification;
generic layered manufacturing technology properties.

General Information

Status : Published

Standard Type: Main

Document No: ISO/TS 10303-1622:2006

Document Year: 2006

Edition: 1

Section Volume:
ISO/TC 184/SC 4. Industrial data

ICS:
25.040.40 Industrial process measurement and control

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ISO/TS 10303-1622:2006

ISO/TS 10303-1622:2006

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