logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 62148-21:2019

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Standard Details

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

General Information

Status : WITHDRAWN
Standard Type: Main
Document No: IEC 62148-21:2019
Document Year: 2019
Pages: 25
Edition: 1.0
  • Section Volume:
  • TC 86.SC 86C Fibre optic systems and active devices
  • ICS:
  • 33.180.20 Fibre optic interconnecting devices

Life Cycle

Currently Viewing

WITHDRAWN
IEC 62148-21:2019
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +