logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 62137-4:2014 (EN-FR)

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Standard Details

IEC 62137-4:2014 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. IEC 62137-4 includes the following significant technical changes with respect to IEC 62137:2004:
- test conditions for use of lead-free solder are included;
- test conditions for lead-free solders are added;
- accelerations of the temperature cycling test for solder joints are added.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62137-4:2014 (EN-FR)
Document Year: 2014
Pages: 85
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

Currently Viewing

ACTIVE
IEC 62137-4:2014 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +