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DIN

DIN EN IEC 62878-2-603 (DRAFT) : 2023

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (IEC 91/1802/CD:2022); Text in German and English

General Information

Status : ACTIVE
Standard Type: Main
Document No: DIN EN IEC 62878-2-603 (DRAFT) : 2023
Document Year: 2023
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
DIN EN IEC 62878-2-603 (DRAFT) : 2023
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