IEC 62878-2-5:2019 (EN-FR)

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

Standard Details

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

General Information

Status : ACTIVE

Standard Type: Main

Document No: IEC 62878-2-5:2019 (EN-FR)

Document Year: 2019

Pages: 112

Edition: 1.0

Section Volume:
TC 91 Electronics assembly technology

ICS:
31.180 Printed circuits and boards
31.190 Electronic component assemblies

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IEC 62878-2-5:2019 (EN-FR)

IEC 62878-2-5:2019 (EN-FR)

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