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IEC 62878-1:2019 (EN-FR)

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Standard Details

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 62878-1:2019 (EN-FR)
Document Year: 2019
Pages: 38
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 62878-1:2019 (EN-FR)
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