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BS EN IEC 62878-2-603:2025

Device embedding assembly technology - Guideline for stacked electronic module. Test method of intra-module electrical connectivity

General Information

Status : Definitive
Standard Type: Main
Document No: BS EN IEC 62878-2-603:2025
Document Year: 2025
Pages: 18
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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Definitive
BS EN IEC 62878-2-603:2025
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