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IEC 60191-6-18:2010/COR2:2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

General Information

Status : ACTIVE
Standard Type: Corrigendum
Document No: IEC 60191-6-18:2010/COR2:2010
Document Year: 2010
Pages: 1
Edition: 1.0
  • ICS:
  • 31.080.01 Semiconductor devices in general

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IEC 60191-6-18:2010/COR2:2010
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