logo

Standards Manage Your Business

We Manage Your Standards

IEC

IEC 61190-1-2:2014 (EN-FR)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Standard Details

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61190-1-2:2014 (EN-FR)
Document Year: 2014
Pages: 46
Edition: 3.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

Currently Viewing

ACTIVE
IEC 61190-1-2:2014 (EN-FR)
Knowledge Corner

Expand Your Knowledge and Unlock Your Learning Potential - Your One-Stop Source for Information!

© Copyright 2024 BSB Edge Private Limited.

Enquire now +