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IEC 61190-1-1:2002 (EN-FR)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Standard Details

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC 61190-1-1:2002 (EN-FR)
Document Year: 2002
Pages: 41
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC 61190-1-1:2002 (EN-FR)
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