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    Semiconductor devices. Micro-electromechanical devices - Micro-pillar compression test for MEMS materials
    BS EN 62047-10:2011 forword
    Semiconductor devices. Micro-electromechanical devices - Micro-pillar compression test for MEMS materials
    Connectors for electronic equipment. Tests and measurements - Sealing tests - Test 14e. Immersion at low air pressure
    BS EN 60512-14-5:2006 forword
    Connectors for electronic equipment. Tests and measurements - Sealing tests - Test 14e. Immersion at low air pressure
    Detail specification for multi-contact circular electrical connectors for d.c. and low frequency applications. Bayonet coupling with front release, rear removable crimp contacts. Full assessment level
    BS 9522 N0001:1982 forword
    Detail specification for multi-contact circular electrical connectors for d.c. and low frequency applications. Bayonet coupling with front release, rear removable crimp contacts. Full assessment level
    Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    PD IEC/PAS 61182-12:2014 forword
    Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    Connectors for electronic equipment. Product requirements - Circular connectors. Detail specification for glass to metal seal style M12 connectors with screw-locking intended to mate with connectors conforming to IEC 61076-2-101
    DD IEC/PAS 61076-2-108:2009 forword
    Connectors for electronic equipment. Product requirements - Circular connectors. Detail specification for glass to metal seal style M12 connectors with screw-locking intended to mate with connectors conforming to IEC 61076-2-101
    Quartz crystal controlled oscillators of assessed quality - Sectional specification. Qualification approval
    BS EN 60679-5:1998 forword
    Quartz crystal controlled oscillators of assessed quality - Sectional specification. Qualification approval
    Connectors for electrical and electronic equipment. Product requirements - Power connectors. Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 40 A
    BS EN IEC 61076-8-101:2020 forword
    Connectors for electrical and electronic equipment. Product requirements - Power connectors. Detail specification for 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing for rated current of 40 A
    BS IEC 61747-20-3. Liquid crystal display devices. Part 20-3. Visual inspection. Active matrix colour liquid crystal display modules
    15/30294919 DC forword
    BS IEC 61747-20-3. Liquid crystal display devices. Part 20-3. Visual inspection. Active matrix colour liquid crystal display modules
    Fixed capacitors for use in electronic equipment - Blank detail specification. Fixed capacitors of ceramic dielectric, Class 2. Assessment level EZ
    BS EN 60384-9-1:2005 forword
    Fixed capacitors for use in electronic equipment - Blank detail specification. Fixed capacitors of ceramic dielectric, Class 2. Assessment level EZ
    Harmonized system of quality assessment for electronic components. Sectional specification: quartz crystal controlled oscillators (capability approval)
    BS EN 169100:1993 forword
    Harmonized system of quality assessment for electronic components. Sectional specification: quartz crystal controlled oscillators (capability approval)
    Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. Glossary - Piezoelectric and dielectric materials. Piezoelectric ceramics
    DD IEC/TS 61994-4-2:2011 forword
    Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. Glossary - Piezoelectric and dielectric materials. Piezoelectric ceramics
    EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)
    BS EN 62433-2:2017 forword
    EMC IC modelling - Models of integrated circuits for EMI behavioural simulation. Conducted emissions modelling (ICEM-CE)
    Semiconductor devices. Semiconductor devices for energy harvesting and generation - Test method for measuring generated power from flexible thermoelectric devices
    BS IEC 62830-5:2021 forword
    Semiconductor devices. Semiconductor devices for energy harvesting and generation - Test method for measuring generated power from flexible thermoelectric devices
    Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (disc type)
    BS EN 143003:1992 forword
    Specification for harmonized system of quality assessment for electronic components. Blank detail specification: directly heated negative temperature coefficient thermistors (disc type)
    Semiconductor devices. Micro-electromechanical devices - Performance testing method of vibration-driven MEMS electret energy harvesting devices
    BS IEC 62047-28:2017 forword
    Semiconductor devices. Micro-electromechanical devices - Performance testing method of vibration-driven MEMS electret energy harvesting devices
    Semiconductor devices. Hot carrier test on MOS transistors
    BS EN 62416:2010 forword
    Semiconductor devices. Hot carrier test on MOS transistors
    Filters for the measurement of audible sound in the presence of ultrasound
    BS EN 61012:1998 forword
    Filters for the measurement of audible sound in the presence of ultrasound
    Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
    BS EN 60749-31:2003 forword
    Semiconductor devices. Mechanical and climatic test methods - Flammability of plastic-encapsulated devices (internally induced)
    Semiconductor devices - Semiconductor sensors. Pressure sensors
    BS IEC 60747-14-3:2009 forword
    Semiconductor devices - Semiconductor sensors. Pressure sensors
    System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
    BS 123100:2001 forword
    System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
    Fixed capacitors for use in electronic equipment - Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte
    BS EN 60384-18:2016 forword
    Fixed capacitors for use in electronic equipment - Sectional specification. Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
    Filters using waveguide type dielectric resonators - Generic specification
    BS EN 61337-1:2004 forword
    Filters using waveguide type dielectric resonators - Generic specification
    Harmonized system of quality assessment for electronic components. Blank detail specification: fixed low power non-wirewound resistors (Assessment levels SB and SC)
    BS EN 140104:1996 forword
    Harmonized system of quality assessment for electronic components. Blank detail specification: fixed low power non-wirewound resistors (Assessment levels SB and SC)
    Optics and photonics. Laser and laser-related equipment. Measurement and evaluation of absorption-induced effects in laser optical components
    PD ISO/TR 22588:2005 forword
    Optics and photonics. Laser and laser-related equipment. Measurement and evaluation of absorption-induced effects in laser optical components
    Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-2-42:2010 forword
    Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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