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PD IEC TR 61189-5-506:2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

General Information

Status : Definitive
Standard Type: Main
Document No: PD IEC TR 61189-5-506:2019
Document Year: 2019
Pages: 26
  • Section Volume:
  • GBM21 Electronic Components & Devices (GMB21)
  • ICS:
  • 31.180 Printed circuits and boards

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Definitive
PD IEC TR 61189-5-506:2019
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