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DIN

DIN EN IEC 61189-2-808 (DRAFT) : 2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

General Information

Status : ACTIVE
Standard Type: Main
Document No: DIN EN IEC 61189-2-808 (DRAFT) : 2022
Document Year: 2022
  • ICS:
  • 31.180 Printed circuits and boards

Life Cycle

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ACTIVE
DIN EN IEC 61189-2-808 (DRAFT) : 2022
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