IPC-T-50 - Revision P : 2025

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Standard Details

This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire harnesses, board packaging, sintered interconnects, soldering, fabrication processes and testing.